The LM746 is an extremely versatile and cost effective solution, enabling audio data to be wirelessly communicated between audio devices, using a Bluetooth® and Bluetooth low energy connection. It’s sound enhancement features make it a perfect fit within your premium audio device.
Bluetooth® Dual Mode v4.1 Programmable Module – LM746
The LM746 Bluetooth® Dual Mode audio module is an extremely versatile and cost effective solution. Enabling audio data to be wirelessly communicated between audio devices. Using a Bluetooth® and Bluetooth low energy connection. It’s sound enhancement features, makes it a perfect fit within your premium audio device. The sound enhancement features includes CSR’s aptX® audio technology. Providing CD-like quality over a Bluetooth® connection. And CSR’s cVc audio technology for noise cancellation. Perfectly suited to wireless headphones, speakers and hand-free headsets.
This standalone module allows the developer to connect a microphone, speakers, capacitive touch sensors, LCD segment displays and other I/O devices. It gives I2S, PCM and SPDIF digital audio interfaces. Running the user application without using an external MCU. LM offer application support to the developer and can create new user applications for the module.
Your developed user application and settings can be preloaded to the LM746, simplifying the manufacturing and testing process. It’s SMT side and bottom pads allows for easy integrations into your embedded system.
- Wireless Headphones and Speakers
- Hand-free Headsets
- Automotive Infotainment systems
- Home Entertainment Devices
- Audio Adapters
- User application support
- aptX® and Faststream CODEC
- SBC, MP3 and AAC decoder
- CSR’s cVc technology for noise-cancellation
- 6 capacitive touch sensor input interfaces
- The digital audio interface supports the industry standard formats for I²S, left-justified or right-justified and PCM
- Microphone input and Speaker output interfaces
- SMT Side and Bottom Pads for easy production
|Programmable (Configurable with AT Commands)
|Profiles (Partially Supported)
|A2DP, AVRCP, HFP, HSP, PBAP
|I2S, PCM, SPDIF
|Onboard IC Antenna
|23.9mm x 16mm x 2.3mm
|-20°C to +75°C
|Backorder Lead Time
|2-3 weeks ARO
|2.0, 2.1, 3, 4, 4.1
|Bluetooth stack location
|AVRCP, PBAP, A2DP, HFP, HSP